DFT TELECOM
400G QSFP112 Direct Attach Cable (DAC) NDR
400G QSFP112 Direct Attach Cable (DAC) NDR
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General Description
QSFP112 passive copper cable assembly feature eight differential copper pairs, providing four data transmission channels at speeds up to 100Gbps(PAM4) per channel, and meets 400G Ethernet and InfiniBand Next Data Rate(NDR) requirements. Available in 26AWG and 30AWG wire gauges, this 400G copper cable assembly features low insertion loss and low crosstalk.
QSFP112 passive copper cable uses PAM4 signals for transmission, which doubles the rate. However, there are more stringent requirements for cable insertion loss. For detailed requirements, please see High Speed Characteristics.
Features and Benefits
l Compatible with IEEE 802.3ck
l Supports aggregate data rates of 400Gbps(PAM4)
l Optimized construction to minimize insertion loss and crosstalk
l Pull-to-release slide latch design
l Straight and break out assembly configurations available
l Customized cable braid termination limits EMI radiation
l Customizable EEPROM mapping for cable signature
l 26AWG and 30AWG cable
l 3.3V Power supply
l Temperature Range: 0~ 70 °C
l RoHS Compliant
Product Applications
.Switches, servers and routers
.Data Center networks
.Storage area networks
.High performance computing
.Telecommunication and wireless infrastructur
.Medical diagnostics and networking
.Test and measurement equipment
Industry Standards
.400G Ethernet(IEEE 802.3ck)
. InfiniBand NDR
Pin Descriptions
QSFP112 Pin Function Definition
|
Pin |
Logic |
Symbol |
Description |
|
1 |
|
GND |
Ground |
|
2 |
CML-I |
Tx2n |
Transmitter Inverted Data Input |
|
3 |
CML-I |
Tx2p |
Transmitter Non-Inverted Data Input |
|
4 |
|
GND |
Ground |
|
5 |
CML-I |
Tx4n |
Transmitter Inverted Data Input |
|
6 |
CML-I |
Tx4p |
Transmitter Non-Inverted Data Input |
|
7 |
|
GND |
Ground |
|
8 |
LVTTL-I |
ModSelL |
Module Select |
|
9 |
LVTTL-I |
ResetL |
Module Reset |
|
10 |
|
Vcc Rx |
+3.3V Power Supply Receiver |
|
11 |
LVCMOS- I/O |
SCL |
2-wire serial interface clock |
|
12 |
LVCMOS- I/O |
SDA |
2-wire serial interface data |
|
13 |
|
GND |
Ground |
|
14 |
CML-O |
Rx3p |
Receiver Non-Inverted Data Output |
|
15 |
CML-O |
Rx3n |
Receiver Inverted Data Output |
|
16 |
|
GND |
Ground |
|
17 |
CML-O |
Rx1p |
Receiver Non-Inverted Data Output |
|
18 |
CML-O |
Rx1n |
Receiver Inverted Data Output |
|
19 |
|
GND |
Ground |
|
20 |
|
GND |
Ground |
|
21 |
CML-O |
Rx2n |
Receiver Inverted Data Output |
|
22 |
CML-O |
Rx2p |
Receiver Non-Inverted Data Output |
|
23 |
|
GND |
Ground |
|
24 |
CML-O |
Rx4n |
Receiver Inverted Data Output |
|
25 |
CML-O |
Rx4p |
Receiver Non-Inverted Data Output |
|
26 |
|
GND |
Ground |
|
27 |
LVTTL-O |
ModPrsL |
Module Present |
|
28 |
LVTTL-O |
IntL |
Interrupt |
|
29 |
|
Vcc Tx |
+3.3V Power supply transmitter |
|
30 |
|
Vcc1 |
+3.3V Power supply |
|
31 |
LVTTL-I |
LPMode |
Low Power Mode |
|
32 |
|
GND |
Ground |
|
33 |
CML-I |
Tx3p |
Transmitter Non-Inverted Data Input |
|
34 |
CML-I |
Tx3n |
Transmitter Inverted Data Input |
|
35 |
|
GND |
Ground |
|
36 |
CML-I |
Tx1p |
Transmitter Non-Inverted Data Input |
|
37 |
CML-I |
Tx1n |
Transmitter Inverted Data Input |
|
38 |
|
GND |
Ground |
General Product Characteristics
|
QSFP112 DAC Specifications |
|
|
Number of Lanes |
Tx4 Rx4
|
|
Channel Data Rate |
106. 25Gbps |
|
Operating Temperature |
0 to + 70°C |
|
Storage Temperature |
-40 to + 85°C |
|
Supply Voltage |
3.3 V nominal |
|
Electrical Interface |
38pins edge connector
|
|
Management Interface |
Serial, I2C |
High Speed Characteristics
|
Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
Note |
|
Differential Impedance |
TDR |
90 |
100 |
110 |
Ώ |
|
|
Insertion loss |
SDD21 |
-19.75 |
|
|
dB |
At 26.56 GHz |
|
Differential Return Loss |
SCD11 SCD22 |
|
|
See 1 |
dB |
At 0.05 to 26.56GHz |
|
|
|
See 2 |
dB |
At 26.56 to 40 GHz |
||
|
Common-mode to common-mode output return loss |
SCC11 SCC22 |
|
|
-1.8 |
dB |
At 0.2 to 40GHz |
|
Differential to common Mode Conversion Loss |
SCD21- SDD21 |
|
|
-10 |
dB |
At 0.05 to 12.89 GHz |
|
|
|
See3 |
At 12.89 to 40 GHz |
|||
|
Notes: 1. Reflection Coefficient given by equation SCD11(dB) <22-10(f/26.56), with f in GHz 2. Reflection Coefficient given by equation SCD11(dB) <15-3(f/26.5), with f in GHz 3. Reflection Coefficient given by equation SCD21-CDD21(dB) < 14-0.3108*f, with f in GHz |
||||||
Mechanical Specifications
The connector is compatible with the SFF8672 specification.

|
Length (m) |
Cable AWG |
|
L≤1M |
30 |
|
1M<L≤2M |
26 |
Regulatory Compliance
|
Feature |
Test Method |
Performance |
|
Electrostatic Discharge (ESD) to the Electrical Pins |
MIL-STD-883C Method 3015.7 |
Class 1(>2000 Volts) |
|
Electromagnetic Interference(EMI) |
FCC Class B |
Compliant with Standards |
|
CENELEC EN55022 Class B |
||
|
CISPR22 ITE Class B |
||
|
RF Immunity(RFI) |
IEC61000-4-3 |
Typically Show no Measurable Effect from a 10V/m Field Swept from 80 to 1000MHz |
|
RoHS Compliance |
RoHS Directive 2011/65/EU and it's Amendment Directives (EU) 2015/863 |
RoHS (EU)2015/863 compliant |
|
REACH Compliance |
REACH Regulation (EC) No 1907/2006 |
REACH (EC) No 1907/2006 compliant |

